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Title	MEMS Packaging
Description-Abstract	The book reviews developments in the following fields: fundamentals of MEMS packaging; joining and bonding technologies; sealing technology; microsystem packaging; automated microassembly; design for test; MEMS packaging in the life sciences; RF and optical packaging in telecommunications; and aerospace application.
Publisher	IET
Subject	Heat treatment -- lcsh Ion implantation -- lcsh Silicon-on-insulator technology -- lcsh annealing -- inspect ion implantation -- inspect SIMOX -- inspect separation-by-implanted-oxygen technology SIMOX silicon-on-insulator structures high temperature annealing
Identifier (Full text)	http://dx.doi.org/10.1049/PBEP003E
ISBN	978-1-84919-062-6
Language	eng
Type	Text
Format-Extent	1 online resource
Date	2004
Relation-Is Part Of	Circuits, Devices and Systems
OCLC number	874496138
CONTENTdm number	1758

MEMS Packaging

Description